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Silicone for potting, encapsulation and bonding LED's

Publish Date 2011-04-12
Name:transparent condensation potting compound
Usage:
Filling for LED,LCD electronic display, circuit board.
Description:
Features & Applications of product
HY210 is condensation silicone potting compound in two parts with low viscosity.
It can be cured completely at room temprature.HY 210 works on the surface of
material as PC(Poly-carbonate)、PP、ABS、PVC as to its superior bonding feature.
It is also applicable for insulation,waterproof and bonding of electronics parts. It meets the
requirements of European RoHs.


Typical Application
-Potting for Protection of general electronic module.
-Outdoor protection for LED screen.

Technical Parameters:

Properties index Part A Part B
Before Curing
Appearence Black fluid Colorless/yellowish fluid
Viscosisty(cps) 2500±500 -
Features when operation Mixing Ratio(By weight) 10:1
Operating Time(25℃ /min) 20~30
Curing time(hr,basically cured) 3
Curing time(hr,perfectly cured) 24
Hardness(shore A) 15±3

After Curing Thermal Conductivity[W(m•K)] ≥0.2
Dielectric Strength(kV/mm) ≥25
Dielectric permittivity(1.2MHz) 3.0~3.3
Volume resistivity(Ω•cm) ≥1.0×1016
Fire Resistance 94-V1
(Pls noet: all data of this product above in 25℃ with 55% humidity conditions. We don't
guarantee a same date if testing under different conditions,or when data was regenerated)

.Warm Tips:
1.Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2.Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3.When it gets stratified after a period of storage, Please mix HY 210 evenly before using,
it does not affect the performance.

PACKAGE
HY210: 22kg/set (Part A 20kg + Part B 2kg)


SHELF LIFE AND TRANSPORTATION
1.Twelve(12) months when stored at 24℃ in original unopened packages.
2.This kind of product is non-dangerous product , it can be transported as
general chemicals.
3.Products exceed the storage life should be confirmed normal before using.

TECHNICAL GUIDELINES
1.Pls put part A and B in separate container and stir evenly before mixing the two
parts together.
2.Weight Ratio: part A:part B = 10:1
3.Bubble release if necessary , Deaeration the mixture under 0.08 MPa for 3 minutes.
4.HY 210 is cured at roon temperature, so pls put it under room temperature after
pouring. It comes to next process when basically cured, and it takes about 24 hours
for completely cured.
Kindly note: Temperature and Humidity with a tremendous influences for curing of
HY210.


Silicone for potting, encapsulation and bonding LED's
Silicone for potting, encapsulation and bonding LED's
Silicone for potting, encapsulation and bonding LED's
Silicone for potting, encapsulation and bonding LED's
Silicone for potting, encapsulation and bonding LED's




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